Facilities

Materials processing:
  • UHV organic molecular beam deposition/epitaxy (OMBD/OMBE) with transfer to/from N2 glove box
  • Chemical vapor deposition (CVD)
  • Rapid thermal processing furnace
  • Thermal evaporation of metal contacts (in N2 glove box)
  • Solution casting in controlled environments, including spin-coating, drop-casting and doctor-blading (in air and in N2 glove box)
  • UV/ozone cleaner
  • Vacuum plasma reactor

Ex situ characterization:
  • Variable angle spectroscopic ellipsometry (VASE)

  • UV-Vis-NIR spectrophotometry (R & T)

  • X-ray and ultraviolet photoelectron spectroscopy (XPS/UPS)

  • Variable temperature UHV STM/STS with Q-plus nc-AFM
  • Polarized optical microscope (POM)
  • Low energy electron diffraction (LEED)
  • Contact angle goniometer

Device testing:
  • Probe station and semiconductor parameter analyzer (in N2 glove box)

  • Solar simulator (in N2 glove box)
  • EQE/IPCE (in N2 glove box)


In situ characterization during solution or vacuum processing:
We use a w​ide array of additional characterization techniques in KAUST's shared facilities, including AFM, SEM, TEM/STEM/EFTEM, Raman, FTIR, NMR. In addition, we also use KAUST's premier scientific visualization facilities as a tool for understanding complex molecular crystalline structures.

We also have several active proposals at synchrotron X-ray radiation sources in the US, including at ALS (LBNL, Berkeley), SSRL (SLAC, Stanford), and CHESS (Cornell), where the Amassian group performs a variety of static and time-resolved scattering, spectroscopy and microscopy measurements on organic semiconductors and colloidal quantum dots used in electronics and in solar energy and low-cost solution processing techniques used to fabricate devices thereof.